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8 layers ENIG Circuit Board
Description
Item | Capability |
Number of Layers | 8 layer |
Material | FR4 |
PCB Thickness | 1.6mm |
Copper Thickness | 1/1/1/1/1/1/1/1 OZ |
Max Finish size | 580X610mm |
Min. Hole size | Min: 0.2mm and max 6.5mm |
Min trace/space | H/H oz 3/3mil; 1/1 oz 4/4mil; |
Finishing | ENIG |
SolderMask | Green |
PeelableMask | Thickness≥ 0.3mm |
Outline profile | CNC Routing. V-CUT. |
Tolerance | Outline: ± 0.1mm/NPTH: ± 0.05mm/PTH/Hole position: ± 0.075mm/V-CUT: ± 0.1mm |
Min Registration between layers | ± 3mil(± 0.076mm) |
Twist and Bow | Follow IPC-A-600G Spec: 0.7%{max} |
Testing | Impedance testing Open/short testing/Universal testing/Flying-prob |