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8 layers 2-stage HDI laser blind holes PCB Prototype
Description
HDI Parameter
Tapes of HDI: 2+N+2 HDI
Number of Layers 8 layer HDI 2+4+2 Stack via hole
Min line width/space： 2mil/2mil
Min mechanical drilling hole diameter： 8mil（0.20mm）
Min liser drill diameter： 3mil（0.075mm）
Blind hole's Aspect Ratio： 1:1
Surface Finishing: OSP, ENIG
SolderMask Green
PeelableMask Thickness≥ 0.3mm
Outline profile CNC Routing. V-CUT.
Tolerance Outline: ± 0.1mm/NPTH: ± 0.05mm/PTH/Hole position: ± 0.075mm/V-CUT: ± 0.1mm
Min Registration between layers ± 3mil(± 0.076mm)
Twist and Bow Follow IPC-A-600G Spec: 0.7%{max}
Testing Impedance testing Open/short testing/Universal testing/Flying-prob
